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E2L0033-17-Y1
Semiconductor MSM518222
Semiconductor 262,214-Word 8-Bit Field Memory
This version: Jan. 1998 MSM518222 Previous version: Dec. 1996
DESCRIPTION
The OKI MSM518222 is a high performance 2-Mbit, 256K 8-bit, Field Memory. It is designed for high-speed serial access applications such as HDTVs, conventional NTSC TVs, VTRs, digital movies and Multi-media systems. The 2-Mbit capacity fits one field of a conventional NTSC TV screen. Two cascaded MSM518222s make one frame of the screen: two or more MSM518222s can be cascaded directly without any delay devices between them. (Cascading provides larger storage depth or a longer delay). Each of the 8-bit planes has separate serial write and read ports. These employ independent control clocks to support asynchronous read and write operations. Different clock rates are also supported, which allow alternate data rates between write and read data streams. The MSM518222 provides high speed FIFO, First-In First-Out, operation without external refreshing: it refreshes its DRAM storage cells automatically, so that it appears fully static to the users. Moreover, fully static type memory cells and decoders for serial access enable the refresh free serial access operation, so that serial read and/or write control clock can be halted high or low for any duration as long as the power is on. Internal conflicts of memory access and refreshing operations are prevented by special arbitration logic. The MSM518222's function is simple and similar to a digital delay device whose delay-bit-length is easily set by reset timing. The delay length, and the number of read delay clocks between write and read, is determined by externally controlled write and read reset timings. Additional SRAM serial registers, or line buffers for the initial access of 256 8-bit enable high speed first-bit-access with no clock delay just after the write or read reset timings. The MSM518222 is similar in operation and functionality to OKI 1-Mbit Field Memory MSM514221B, with the addition of cascade capability. (As for MSM514221B operation compatible 2-Mbit Field Memory, OKI has the MSM518221 which is a sister device of MSM518222). Additionally, the MSM518222 has a write mask function or input enable function (IE), and read-data skipping function or output enable function (OE). The differences between write enable (WE) and input enable (IE), and between read enable (RE) and output enable (OE) are that WE and RE can stop serial write/read address increments, but IE and OE cannot stop the increment, when write/read clocking is continuously applied to MSM518222. The input enable (IE) function allows the user to write into selected locations of the memory only, leaving the rest of the memory contents unchanged. This facilitates data processing to display a "picture in picture" on a TV screen.
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Semiconductor
MSM518222
FEATURES
* Single power supply : 5 V 10% * 512 Rows 512 Columns 8 bits * Fast FIFO (First-In First-Out) operation * High speed asynchronous serial access Read/write cycle time 25 ns/30 ns/40 ns Access time 25 ns/25 ns/30 ns * Direct cascading capability * Write mask function (Input enable control) * Data skipping function (Output enable control) * Self refresh (No refresh control is required) * Package options : 28-pin 400 mil plastic ZIP (ZIP28-P-400-1.27) 28-pin 400 mil plastic SOJ (SOJ28-P-400-1.27) 28-pin 430 mil plastic SOP (SOP28-P-430-1.27-K)
(Product : MSM518222-xxZS) (Product : MSM518222-xxJS) (Product : MSM518222-xxGS-K) xx indicates speed rank.
PRODUCT FAMILY
Family MSM518222-25ZS MSM518222-30ZS MSM518222-40ZS MSM518222-25JS MSM518222-30JS MSM518222-40JS MSM518222-30GS-K MSM518222-40GS-K Access Time (Max.) 25 ns 25 ns 30 ns 25 ns 25 ns 30 ns 25 ns 30 ns Cycle Time (Min.) 25 ns 30 ns 40 ns 25 ns 30 ns 40 ns 30 ns 40 ns 430 mil 28-pin SOP 400 mil 28-pin SOJ 400 mil 28-pin ZIP Package
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Semiconductor
PIN CONFIGURATION (TOP VIEW)
WE DIN0 DIN2 VCC DIN5
1 3 5 7 9
2 4 6 8
IE DIN1 DIN3 DIN4
10 DIN6 12 RSTW 14 NC 16 RE 18 DOUT7 20 DOUT5 22 VSS 24 DOUT2 26 DOUT0 28 SRCK
DIN7 11 SWCK 13 NC 15 OE 17 DOUT6 19 DOUT4 21 DOUT3 23 DOUT1 25 RSTR 27
DIN4 1 DIN5 2 DIN6 3 DIN7 4 28 VCC DIN4 1 DIN5 2 DIN6 3 DIN7 4 27 DIN3 26 DIN2 25 DIN1 24 DIN0 23 IE 22 WE 21 NC RSTW 5 NC 7 RE 8 RSTW 5 SWCK 6 SWCK 6 NC 7 RE 8 OE 9 OE 9 20 SRCK 19 RSTR 18 DOUT0 17 DOUT1 16 DOUT2 15 DOUT3 DOUT7 10 DOUT6 11 DOUT5 12 DOUT4 13 VSS 14 DOUT7 10 DOUT6 11 DOUT5 12 DOUT4 13 VSS 14 28-Pin Plastic SOJ
MSM518222
28 VCC 27 DIN3 26 DIN2 25 DIN1 24 DIN0 23 IE 22 WE 21 NC 20 SRCK 19 RSTR 18 DOUT0 17 DOUT1 16 DOUT2 15 DOUT3
28-Pin Plastic SOP
28-Pin Plastic ZIP
Pin Name SWCK SRCK WE RE IE OE RSTW RSTR DIN0 - 7 DOUT0 - 7 VCC VSS NC
Function Serial Write Clock Serial Read Clock Write Enable Read Enable Input Enable Output Enable Write Reset Clock Read Reset Clock Data Input Data Output Power Supply (5 V) Ground (0 V) No Connection
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Semiconductor
DOUT ( 8)
OE
RE
BLOCK DIAGRAM
RSTR
SRCK
Data-out Buffer ( 8)
Serial
Read
Controller
512 Word Serial Read Register ( 8) Read Line Buffer Low-Half ( 8) 256 ( 8) 71 Word Sub-Register ( 8) 256K ( 8) Memory Array 71 Word Sub-Register ( 8) 256 ( 8) Write Line Buffer Low-Half ( 8) 256 ( 8) Write Line Buffer High-Half ( 8) Clock Oscillator X Decoder Read/Write and Refresh Controller Read Line Buffer High-Half ( 8) 256 ( 8)
512 Word Serial Write Register ( 8) VBB Generator Data-in Buffer ( 8)
MSM518222
Serial
Write
Controller
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DIN ( 8)
IE
WE
RSTW
SWCK
Semiconductor
MSM518222
OPERATION
Write Operation The write operation is controlled by three clocks, SWCK, RSTW, and WE. Write operation is accomplished by cycling SWCK, and holding WE high after the write address pointer reset operation or RSTW. Each write operation, which begins after RSTW, must contain at least 80 active write cycles, i.e. SWCK cycles while WE is high. To transfer the last data to the DRAM array, which at that time is stored in the serial data registers attached to the DRAM array, an RSTW operation is required after the last SWCK cycle. Note that every write timing of MSM518222 is delayed by one clock compared with read timings for easy cascading without any interface delay devices. Write Reset : RSTW The first positive transition of SWCK after RSTW becomes high resets the write address counters to zero. RSTW setup and hold times are referenced to the rising edge of SWCK. Because the write reset function is solely controlled by the SWCK rising edge after the high level of RSTW, the states of WE and IE are ignored in the write reset cycle. Before RSTW may be brought high again for a further reset operation, it must be low for at least two SWCK cycles. Data Inputs : DIN0 - 7 Write Clock : SWCK The SWCK latches the input data on chip when WE is high, and also increments the internal write address pointer. Data-in setup time tDS, and hold time tDH are referenced to the rising edge of SWCK. Write Enable : WE WE is used for data write enable/disable control. WE high level enables the input, and WE low level disables the input and holds the internal write address pointer. There are no WE disable time (low) and WE enable time (high) restrictions, because the MSM518222 is in fully static operation as long as the power is on. Note that WE setup and hold times are referenced to the rising edge of SWCK. Input Enable : IE IE is used to enable/disable writing into memory. IE high level enables writing. The internal write address pointer is always incremented by cycling SWCK regardless of the IE level. Note that IE setup and hold times are referenced to the rising edge of SWCK.
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Semiconductor
MSM518222
Read Operation The read operation is controlled by three clocks, SRCK, RSTR, and RE. Read operation is accomplished by cycling SRCK, and holding RE high after the read address pointer reset operation or RSTR. Each read operation, which begins after RSTR, must contain at least 80 active read cycles, i.e. SRCK cycles while RE is high. Read Reset : RSTR The first positive transition of SRCK after RSTR becomes high resets the read address counters to zero. RSTR setup and hold times are referenced to the rising edge of SRCK. Because the read reset function is solely controlled by the SRCK rising edge after the high level of RSTR, the states of RE and OE are ignored in the read reset cycle. Before RSTR may be brought high again for a further reset operation, it must be low for at least *two SRCK cycles. Data Out : DOUT0 - 7 Read Clock : SRCK Data is shifted out of the data registers. It is triggered by the rising edge of SRCK when RE is high during a read operation. The SRCK input increments the internal read address pointer when RE is high. The three-state output buffer provides direct TTL compatibility (no pullup resistor required). Data out is the same polarity as data in. The output becomes valid after the access time interval tAC that begins with the rising edge of SRCK. *There are no output valid time restrictions on MSM518222. Read Enable : RE The function of RE is to gate the SRCK clock for incrementing the read pointer. When RE is high before the rising edge of SRCK, the read pointer is incremented. When RE is low, the read pointer is not incremented. RE setup times (tRENS and tRDSS) and RE hold times (tRENH and tRDSH) are referenced to the rising edge of the SRCK clock. Output Enable : OE OE is used to enable/disable the outputs. OE high level enables the outputs. The internal read address pointer is always incremented by cycling SRCK regardless of the OE level. Note that OE setup and hold times are referenced to the rising edge of SRCK.
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Semiconductor
MSM518222
Power-up and Initialization On power-up, the device is designed to begin proper operation after at least 100 ms after VCC has stabilized to a value within the range of recommended operating conditions. After this 100 ms stabilization interval, the following initialization sequence must be performed. Because the read and write address counters are not valid after power-up, a minimum of 80 dummy write operations (SWCK cycles) and read operations (SRCK cycles) must be performed, followed by an RSTW operation and an RSTR operation, to properly initialize the write and the read address pointer. Dummy write cycles/RSTW and dummy read cycles/RSTR may occur simultaneously. If these dummy read and write operations start while VCC and/or the substrate voltage has not stabilized, it is necessary to perform an RSTR operation plus a minimum of 80 SRCK cycles plus another RSTR operation, and an RSTW operation plus a minimum of 80 SRCK cycles plus another RSTW operation to properly initialize read and write address pointers. Old/New Data Access There must be a minimum delay of 600 SWCK cycles between writing into memory and reading out from memory. If reading from the first field starts with an RSTR operation, before the start of writing the second field (before the next RSTW operation), then the data just written will be read out. The start of reading out the first field of data may be delayed past the beginning of writing in the second field of data for as many as 70 SWCK cycles. If the RSTR operation for the first field read-out occurs less than 70 SWCK cycles after the RSTW operation for the second field write-in, then the internal buffering of the device assures that the first field will still be read out. The first field of data that is read out while the second field of data is written is called "old data". In order to read out"new data", i.e., the second field written in, the delay between an RSTW operation and an RSTR operation must be at least 600 SRCK cycles. If the delay between RSTW and RSTR operations is more than 71 but less than 600 cycles, then the data read out will be undetermined. It may be "old data" or "new" data, or a combination of old and new data. Such a timing should be avoided. Cascade Operation The MSM518222 is designed to allow easy cascading of multiple memory devices. This provides higher storage depth, or a longer delay than can be achieved with only one memory device.
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Semiconductor
MSM518222
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
Parameter Input Output Voltage Output Current Power Dissipation Operating Temperature Storage Temperature Symbol VT IOS PD Topr Tstg Condition at Ta = 25C, VSS Ta = 25C Ta = 25C -- -- Rating -1.0 to 7.0 50 1 0 to 70 -55 to 150 Unit V mA W C C
Recommended Operating Conditions
Parameter Power Supply Voltage Power Supply Voltage Input High Voltage Input Low Voltage Symbol VCC VSS VIH VIL Min. 4.5 0 2.4 -1.0 Typ. 5.0 0 VCC 0 Max. 5.5 0 VCC + 1 0.8 Unit V V V V
DC Characteristics
Parameter Input Leakage Current Output Leakage Current Output "H" Level Voltage Output "L" Level Voltage Operating Current Standby Current Symbol ILI ILO VOH VOL ICC1 ICC2 Condition 0 < VI < VCC + 1, Other Pins Tested at V = 0 V 0 < VO < VCC IOH = -1 mA IOL = 2 mA -25 Minimum Cycle Time, Output Open -30 -40 Input Pin = VIH / VIL Min. -10 -10 2.4 -- -- -- -- -- Max. 10 10 -- 0.4 60 50 40 5 mA mA Unit mA mA V V
Capacitance
Parameter Input Capacitance (DIN, SWCK, SRCK, RSTW, RSTR, WE, RE, IE, OE) Output Capacitance (DOUT) Symbol CI CO
(Ta = 25C, f = 1 MHz) Max. 7 7 Unit pF pF
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Semiconductor AC Characteristics
MSM518222
(VCC = 5 V 10%, Ta = 0C to 70C) MSM518222-25 Parameter Access Time from SRCK DOUT Hold Time from SRCK DOUT Enable Time from SRCK SWCK "H" Pulse Width SWCK "L" Pulse Width Input Data Setup Time Input Data Hold Time WE Enable Setup Time WE Enable Hold Time WE Disable Setup Time WE Disable Hold Time IE Enable Setup Time IE Enable Hold Time IE Disable Setup Time IE Disable Hold Time WE "H" Pulse Width WE "L" Pulse Width IE "H" Pulse Width IE "L" Pulse Width RSTW Setup Time RSTW Hold Time SRCK "H" Pulse Width SRCK "L" Pulse Width RE Enable Setup Time RE Enable Hold Time RE Disable Setup Time RE Disable Hold Time OE Enable Setup Time OE Enable Hold Time OE Disable Setup Time OE Disable Hold Time RE "H" Pulse Width RE "L" Pulse Width OE "H" Pulse Width OE "L" Pulse Width RSTR Setup Time RSTR Hold Time SWCK Cycle Time SRCK Cycle Time Transition Time (Rise and Fall) Symbol tAC tDDCK tDECK tWSWH tWSWL tDS tDH tWENS tWENH tWDSS tWDSH tIENS tIENH tIDSS tIDSH tWWEH tWWEL tWIEH tWIEL tRSTWS tRSTWH tWSRH tWSRL tRENS tRENH tRDSS tRDSH tOENS tOENH tODSS tODSH tWREH tWREL tWOEH tWOEL tRSTRS tRSTRH tSWC tSRC tT Min. -- 6 6 9 9 5 6 0 5 0 5 0 5 0 5 5 5 5 5 0 10 9 9 0 5 0 5 0 5 0 5 5 5 5 5 0 10 25 25 3 Max. 25 -- 25 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 30 MSM518222-30 Min. -- 6 6 12 12 5 6 0 5 0 5 0 5 0 5 10 10 10 10 0 10 12 12 0 5 0 5 0 5 0 5 10 10 10 10 0 10 30 30 3 Max. 25 -- 25 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 30 MSM518222-40 Min. -- 6 6 17 17 5 6 0 5 0 5 0 5 0 5 10 10 10 10 0 10 17 17 0 5 0 5 0 5 0 5 10 10 10 10 0 10 40 40 3 Max. 30 -- 25 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 30 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
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Semiconductor
MSM518222
Notes: 1. Input signal reference levels for the parameter measurement are VIH = 3.0 V and VIL = 0 V. The transition time tT is defined to be a transition time that signal transfers between VIH = 3.0 V and VIL = 0 V. 2. AC measurements assume tT = 3 ns. 3. Read address must have more than a 600 address delay than write address in every cycle when asynchronous read/write is performed. 4. Read must have more than a 600 address delay than write in order to read the data written in a current series of write cycles which has been started at last write reset cycle: this is called "new data read". When read has less than a 70 address delay than write, the read data are the data written in a previous series of write cycles which had been written before the last write reset cycle: this is called "old data read". 5. When the read address delay is between more than 71 and less than 599, read data will be undetermined. However, normal write is achieved in this address condition. 6. Outputs are measured with a load equivalent to 1 TTL load and 30 pF. Output reference levels are VOH = 2.4 V and VOL = 0.8 V.
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Semiconductor
MSM518222
TIMING WAVEFORM
Write Cycle Timing (Write Reset)
n cycle 0 cycle 1 cycle 2 cycle VIH VIL tRSTWS tRSTWH tWSWH tWSWL
SWCK
tT RSTW tDH tDS
tSWC
VIH VIL
SWCK
WE
DIN
IE
,
DIN n-1 n 0 1 2 VIH VIL WE VIH VIL VIH VIL IE
Write Cycle Timing (Write Enable)
n cycle
Disable cycle
Disable cycle
n+1 cycle
VIH VIL
tWENH
tWDSH
tWDSS
tWENS
VIH VIL
tWWEL
tWWEH
n-1
n
n+1
VIH VIL
VIH VIL VIH VIL
RSTW
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Semiconductor
Write Cycle Timing (Input Enable)
n cycle
SRCK
RSTR
,
MSM518222
n+1 cycle n+2 cycle n+3 cycle SWCK VIH VIL tIENH tIDSH tIDSS tIENS IE VIH VIL tWIEL tWIEH DIN n-1 n n+3 VIH VIL WE VIH VIL VIH VIL RSTW
Read Cycle Timing (Read Reset)
n cycle
0 cycle
1 cycle
2 cycle
VIH VIL
tT
tRSTRS
tRSTRH
tWSRH
tWSRL
tSRC
VIH VIL
tAC
tDDCK
DOUT
n-1
n
0
1
2
VOH VOL
RE
VIH VIL VIH VIL
OE
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SRCK
OE
DOUT
RE
, ,
Semiconductor MSM518222 Read Cycle Timing (Read Enable)
n cycle Disable cycle Disable cycle n+1 cycle SRCK VIH VIL tRENH tRDSH tRDSS tRENS RE VIH VIL tWREL tWREH DOUT n-1 n n+1 VOH VOL OE VIH VIL VIH VIL RSTR
Read Cycle Timing (Output Enable)
n cycle
n+1 cycle
n+2 cycle
n+3 cycle
VIH VIL
tOENH
tODSH
tODSS
tOENS
VIH VIL
tWOEN
tWOEH
tDECK
n-1
n
Hi-Z
n+3
VOH VOL
VIH VIL VIH VIL
RSTR
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Semiconductor
MSM518222
PACKAGE DIMENSIONS
(Unit : mm)
ZIP28-P-400-1.27
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.85 TYP.
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Semiconductor
MSM518222
(Unit : mm)
SOJ28-P-400-1.27
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 1.30 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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Semiconductor
MSM518222
(Unit : mm)
SOP28-P-430-1.27-K
Mirror finish
Package material Lead frame material Pin treatment Solder plate thickness Package weight (g)
Epoxy resin 42 alloy Solder plating 5 mm or more 0.75 TYP.
Notes for Mounting the Surface Mount Type Package The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which are very susceptible to heat in reflow mounting and humidity absorbed in storage. Therefore, before you perform reflow mounting, contact Oki's responsible sales person for the product name, package name, pin number, package code and desired mounting conditions (reflow method, temperature and times).
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